TSMC staffing R&D for the 3nm process

October 03, 2016 // By Julien Happich
Taiwan Semiconductor Manufacturing Co., Ltd. (TSMC) will actively develop 5-nanometer process technology, while dedicating between 300 and 400 R&D personnel in developing a 3-nanometer process, ultimately aiming at the 1-nanometer manufacturing process, reports Taiwanese magazine CTimes.

In an interview, Dr. Mark Liu, President and Co-Chief Executive Officer of TSMC, said the company will use its three-dimensional stacked architecture technology to break the limitation of Moore's law and move toward the 3nm manufacturing node.

Liu stressed that TSMC has established the complete ecosystems with the intellectual property, automation solutions and equipment providers, and will continue to invest in technology development and research, and to make Taiwan become the strongest fortress in the global semiconductor industry.

He also said that the role of Taiwan's semiconductor industry became more and more important in the global semiconductor market with a share of 21%, where its output ranks first place in the foundry, IC packaging and testing business, and IC design ranks the world's second and the Fourth in memory production.

 

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