The VIA VAB-800 combines a wide operating temperature range with extremely low power consumption to meet the demands of high-end industrial and in-vehicle fanless embedded applications. Based on the industry standard 10 cm x 7.2 cm Pico-ITX form factor created by VIA, the VAB-800 delivers the highest I/O integration on the Pico-ITX form factor for an ultra compact yet highly flexible platform for the latest embedded devices.
The ruggedized VIA VAB-800 Pico-ITX supports a wide operating temperature range from -20 to 70°C in an ultra low TDP envelope of only 5W and is backed with a minimum seven years longevity support.
Customers can take advantage of VIA’s worldwide embedded software development expertise to quickly create customized designs for a fast time to market approach and is available as a hardware starter kit with board support packages (BSPs) for the Android, Ubuntu and Windows Embedded Compact 7 operating systems.
“The VIA VAB-800 extends our industry leading range of Pico-ITX embedded platforms,” said Epan Wu, Head of the VIA Embedded Platform Division, VIA Technologies, Inc. “As a leader in hardware and software support, VIA can tailor our new ARM based offerings for customers to create systems through starter kits, customization support or offering complete systems for different applications.”
Rear I/O includes one Mini HDMI and one VGA display port, two USB ports and one 10/100 Ethernet port. On-board features include up to 64GB eMMC Flash memory, 1GB DDR3 SDRAM, support for one SATA port, two single channel LVDS display ports, two COM ports, CAN Bus, front pin headers for line-in/out and MIC-in, a further two USB 2.0 ports, an SDIO pin header and eight GPIOs.