Western Digital doubles 3D-NAND capacity

February 14, 2017 // By Peter Clarke
Western Digital has started production of a 512Gbit 64-layer 3D-NAND flash memory with its manufacturing partner Toshiba in Yokkaichi, Japan. Mass production is expected in the second half of 2017.

Western Digital introduced a 256Gbit 3D-NAND flash memory in July 2016 (see Western Digital claims first 64-layer 3D NAND memory ). Like that chip the latest model uses 64-layers and three-bits-per-cell implemented in Toshiba's BICS3 technology.

Western Digital is presenting a technical paper the high aspect ratio semiconductor processing that allows 3D-NAND at the International Solid State Circuits Conference (ISSCC) in San Francisco.

Related links and articles:

www.wdc.com

www.toshiba.com

www.isscc.org

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