Today's news
- Smart grid protocol will ride Wi-Fi at home
- IBM, Novellus form 3-D alliance
- Automotive connectors from RS Components
- Geotest and Pickering Interfaces' strategic alliance to boost PXI testing
- Bosch launches 200mm wafer fab
- Panasonic and MSC sign pan-European distribution deal for low energy wireless solutions
- Goepel electronic expands GATE partner program
- Tyndall CEO touts junctionless transistor to the Valley
- MicroUnity sues mobile giants for patent infringement
- Forecaster sees DRAM shortages on the horizon
New Products
- Cat 5E miniature trunk cable for high data-rates
- Rectangular connectors conform to MIL, ESA qualifications
- Snap-on and ultrasonic PCMCIA I/O kits
- Sigasi adds Eclipse version of IDE
- Versatile Eurotec case-frame fully configurable
- ATCA blade with dual 6-core Intel Xeon processor
- Atom use expands DuraCOR range
- SystemVue now links C++ code generation and X-parameters for RF-DSP co-design
- Linking C++ code generation and X-parameters for RF-DSP co-design
- InGaP HBT gain block amplifiers for WiMAX, base stations, satellite TV and set-top boxes
Next events
March 16, 2010
to April 29, 2010
- Seminars
Linear Technology Power µModule Seminars
March 18, 2010
to March 19, 2010
- Seminars
Invest in Photonics - Bordeaux
March 18, 2010
to April 28, 2010
- Webinars
Rutronik Webinars encompass all product divisions
March 22, 2010
to March 24, 2010
- Seminars
International Symposium on Quality Electronic Design (ISQED) - San Jose
March 23, 2010
to February 24, 2010
- Seminars
MOST Forum 2010 - Frankfurt
MOST POPULAR NEWS
- Cat 5E miniature trunk cable for high data-rates
- Rectangular connectors conform to MIL, ESA qualifications
- Smart grid protocol will ride Wi-Fi at home
- IBM, Novellus form 3-D alliance
- Automotive connectors from RS Components
- Geotest and Pickering Interfaces' strategic alliance to boost PXI testing
- Bosch launches 200mm wafer fab
- Panasonic and MSC sign pan-European distribution deal for low energy wireless solutions
- Snap-on and ultrasonic PCMCIA I/O kits
- Sigasi adds Eclipse version of IDE
Numonyx Embedded Design Center
Interview
Technical papers
- Why hardware designers should switch to Eclipse
- LED Reference Design Cookbook
- Power supplies go digital
- How the smart grid will energize the world
- μPower Buck Regulator Safely Rides Through Automotive Load Dumps
- An integrated automotive display solution for powering auto infotainment systems
- Hardware solutions to the Challenges of multimedia IP functional verification
- Analog VGA Simplifies Design and Outperforms Competing Gain Control Methods
- Simple Calibration Circuit Maximizes Accuracy in Li-Ion Battery Management Systems
- Isolated Supply Overview and Design Trade-Offs
Reader Offer
The STEVAL-MKI062V1 (iNEMO) launched by STMicroelectronics is a unique platform designed to demonstrate the performance of ST's most advanced inertial, temperature and pressure sensors.This month, STMicroelectronics is giving away five such kits, worth 260,90 Euros each, for EETimes Europe's readers to win.
And the winners are...In our previous reader offer, Anders Electronics was giving away a complete 5.7” UMR intelligent display evaluation kit valued at £2,000. The lucky winner is Mr. S. Hayden from the United Kingdom. Mr Hayden will be evaluating the display solution for use in a medical laser interface.
Poll
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This site contains articles under license from EETimes Group , a division of United Business Media LLC.
This site contains articles under license from EETimes Group , a division of United Business Media LLC.


Innovative Silicon's test chip generated at Hynix demonstrated the Z-RAM zero-capacitor, floating body (FB) memory technology could be the lowest cost and lowest power DRAM replacement technology. Innovative ...
